The performance of any electronic gadgets depends on the segments utilized as well as how well they are appended to their contact pad. Given the exactness with which the parts must be connected, special machines are required to perform this fragile task. The machines that are always present in any genuine electronic assembling company are the smt reflow ovens.
The ovens are designed to assist in the process of reflow soldering; the technique whereby some sticky soldering paste made of solder and flux is used to temporarily attach electrical components to the contact pads. This is then followed by highly controlled heating aiming to melt the solder so as to permanently connect the components to the circuit board.
With this machine, the assembly of surface mount (smt) parts on to the circuit board is much easier and several units can be produced in minutes. This eliminates unnecessarily long labor hours as it is usually the case when the traditional method of soldering individual component separately is done. The oven is able to heat and melt the solder at the right temperature leaving no damage to the components or the circuit board. The commonplace reflow oven operates in four stages which are preheat, the thermal soak, the reflow and the cooling zone.
In the preheat zone, the incline rate is secured. This is the rate of temperature rise per second. It is normally 1 to 3 degrees for every second. It should not surpass the most extreme incline as this can damage the parts or split the mother board. It can likewise prompt the scattering impact. The solvent in the mixture too begins to dissipate in the zone.
The thermal soak zone is the next step lasting for between sixty to one hundred and twenty seconds removing all the solder paste volatiles in the process. The flux segments also begin oxidation of the segment cushions and leads, a procedure known as flux initiation. The temperature must be correct, with low temperatures, flux fails to completely enact while high temperatures leads to spattering, balling or oxidation of the paste.
The reflow zone then takes over. In this zone, the highest possible temperature as determined by the component with the lowest temperature tolerance in the assembly is reached. The common peak is usually from 20 to 40 degree centigrade above liquidus.
Ultimately, the cooling zone is the last step. It is utilized to cool the prepared board in a controlled way setting all joints as required. In a proper manner, this stage should prevent any intermetallic formation or even the thermal shock. Faster cooling is however done to so as to accomplish fine grains. All in all, there is a need for efficient control system, something possible with most of the modern designs.
The electronic assembly firms that are on the path of growth and profitability normally install new and the latest model machines. These are often associated with efficiency and reduced energy consumption. It is now possible to find the models of smt ovens that fit the description. The process of procuring one however must be done carefully. This involves understanding as much as possible about the manufacturers, the suppliers and the product itself.
The ovens are designed to assist in the process of reflow soldering; the technique whereby some sticky soldering paste made of solder and flux is used to temporarily attach electrical components to the contact pads. This is then followed by highly controlled heating aiming to melt the solder so as to permanently connect the components to the circuit board.
With this machine, the assembly of surface mount (smt) parts on to the circuit board is much easier and several units can be produced in minutes. This eliminates unnecessarily long labor hours as it is usually the case when the traditional method of soldering individual component separately is done. The oven is able to heat and melt the solder at the right temperature leaving no damage to the components or the circuit board. The commonplace reflow oven operates in four stages which are preheat, the thermal soak, the reflow and the cooling zone.
In the preheat zone, the incline rate is secured. This is the rate of temperature rise per second. It is normally 1 to 3 degrees for every second. It should not surpass the most extreme incline as this can damage the parts or split the mother board. It can likewise prompt the scattering impact. The solvent in the mixture too begins to dissipate in the zone.
The thermal soak zone is the next step lasting for between sixty to one hundred and twenty seconds removing all the solder paste volatiles in the process. The flux segments also begin oxidation of the segment cushions and leads, a procedure known as flux initiation. The temperature must be correct, with low temperatures, flux fails to completely enact while high temperatures leads to spattering, balling or oxidation of the paste.
The reflow zone then takes over. In this zone, the highest possible temperature as determined by the component with the lowest temperature tolerance in the assembly is reached. The common peak is usually from 20 to 40 degree centigrade above liquidus.
Ultimately, the cooling zone is the last step. It is utilized to cool the prepared board in a controlled way setting all joints as required. In a proper manner, this stage should prevent any intermetallic formation or even the thermal shock. Faster cooling is however done to so as to accomplish fine grains. All in all, there is a need for efficient control system, something possible with most of the modern designs.
The electronic assembly firms that are on the path of growth and profitability normally install new and the latest model machines. These are often associated with efficiency and reduced energy consumption. It is now possible to find the models of smt ovens that fit the description. The process of procuring one however must be done carefully. This involves understanding as much as possible about the manufacturers, the suppliers and the product itself.
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