The world today is full of electronic devises that help you live an easier life. They come in the form of smart phones, tablets, lap top computers and too many other things to list. The thing most of these items have in common is they all use circuit boards to help maintain continuous service. The reflow soldering oven is one of the machines used to create the circuit boards that are so vital to the communications industry.
This machine is used to permanently solder two flat components together. The process uses a powdered solder mixture that is placed at critical locations on the board and circuits to be soldered. The prepared board is then heated to the point of melting the solder to permanently affix the two components together. There are four stages in conventional processing typically called zones.
The first zone is a preheat period where the boards and other components are heated to determine the ramp up rate. If the boards and circuitry heat up too fast it can cause damage to the components from thermal shock causing cracking and also spattering of solder paste. If the heating process is too low the needed evaporation of the flux in the paste will be incomplete.
The second step is called a thermal soak. In this zone the board sits for up to two minutes in the heat and works to activate flux components that starts the oxide reduction and removes the excess paste from the actual circuit ends and pads. As with all steps in this process the temperature must be exact. Too high and there will be spattering or balling of any solder being used. Before moving to the next level the boards receive a complete thermal assessment.
Next is the reflow zone. This is one of the most sensitive zones in the process. It is when the highest temperatures will be used on the board. Every piece has a temperature where the most fragile component is damaged by heat. If this temperature is surpassed thermal damage will occur making the piece non-functional. Operators must closely monitor the process to ensure this does not happen.
Finally the cool down zone where the board gradually cools allowing solder to solidify. Although not as critical as the ramp up process an appropriate cooling process can also help prevent damage to the boards. Specialists recommend a rate of under five degrees per second for cool down.
Having a window to watch the entire process is one of the ways the manufacturer helps the operator. Most of the machines are computerized and can be pre-programmed to do the work without human assistance but being able to see what is happening is important especially on a new run. Many have USB connections so the operators can view them on their computers.
These ovens come in many different sizes. They may range from small units that can be placed on the surface of a bench to units that are longer than six feet. The importance of them is demonstrated everyday in products used to communicate with others as well as for mobile intelligence and gaming. They help to make the world smaller with each new devise they help to create.
This machine is used to permanently solder two flat components together. The process uses a powdered solder mixture that is placed at critical locations on the board and circuits to be soldered. The prepared board is then heated to the point of melting the solder to permanently affix the two components together. There are four stages in conventional processing typically called zones.
The first zone is a preheat period where the boards and other components are heated to determine the ramp up rate. If the boards and circuitry heat up too fast it can cause damage to the components from thermal shock causing cracking and also spattering of solder paste. If the heating process is too low the needed evaporation of the flux in the paste will be incomplete.
The second step is called a thermal soak. In this zone the board sits for up to two minutes in the heat and works to activate flux components that starts the oxide reduction and removes the excess paste from the actual circuit ends and pads. As with all steps in this process the temperature must be exact. Too high and there will be spattering or balling of any solder being used. Before moving to the next level the boards receive a complete thermal assessment.
Next is the reflow zone. This is one of the most sensitive zones in the process. It is when the highest temperatures will be used on the board. Every piece has a temperature where the most fragile component is damaged by heat. If this temperature is surpassed thermal damage will occur making the piece non-functional. Operators must closely monitor the process to ensure this does not happen.
Finally the cool down zone where the board gradually cools allowing solder to solidify. Although not as critical as the ramp up process an appropriate cooling process can also help prevent damage to the boards. Specialists recommend a rate of under five degrees per second for cool down.
Having a window to watch the entire process is one of the ways the manufacturer helps the operator. Most of the machines are computerized and can be pre-programmed to do the work without human assistance but being able to see what is happening is important especially on a new run. Many have USB connections so the operators can view them on their computers.
These ovens come in many different sizes. They may range from small units that can be placed on the surface of a bench to units that are longer than six feet. The importance of them is demonstrated everyday in products used to communicate with others as well as for mobile intelligence and gaming. They help to make the world smaller with each new devise they help to create.
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